DEVELOPMENT OF ADVANCED MICROWAVE ABSORBING MATERIALS FOR ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING IN NEXT-GENERATION ELECTRONIC SYSTEMS
DOI:
https://doi.org/10.71146/kjmr281Keywords:
Electromagnetic interference (EMI), microwave-absorbing materials, MXenes, graphene, carbon nanotubes (CNTs), polymer composites, shielding effectiveness, next-generation electronicsAbstract
The growing use of portable electronic equipment and wireless communication systems has amplified the issue of electromagnetic interference (EMI), thus the need to design high-performance microwave absorbing materials. That is why traditional metal based shielding materials are good conductors but they include high density, corrosion and poor fatigue resistance and are rigid in nature. This work investigates the fabrication and EMI shielding characteristics of graphene, CNTs, MXenes, and the polymer-ferrite composites based on electrical conductivity, dielectric constant, mechanical strength, and thermal stability. In the case of shielding effectiveness, the MXene composites afforded 52.4 dB which is much higher than for graphene (42.1 dB) and CNT-polymer composites (39.2 dB) because of its higher conductivity and efficient absorption properties. In comparison to the commercial shielding materials, it was realized that these composites provided propitious performance enhancement in flexibility and considerably low weight. The results indicate that coating with MXene can integrate excellent properties with polymers to be the most potential candidates for the next-generation EMI shielding applications especially for 5G, IoT, aerospace, and wearable electronics. Additional research directions include improving large scale fabrication technology, combining carbon nanostructures, and discovering environmentally friendly shielding materials.
Downloads

Downloads
Published
Issue
Section
License
Copyright (c) 2025 Saddam Hussain, Madiha Liaquat, Zamin Abbas (Author)

This work is licensed under a Creative Commons Attribution 4.0 International License.